Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity testing of MEMS and microelectronic packages

Rubber seals for fluid and hydraulic systems

Rubber seals for fluid and hydraulic systems

Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan

Adhesives, sealants, and coatings for the electronics industry

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Adhesives technology for electronic applications : materials, processing, reliability

Adhesives technology for electronic applications : materials, processes, reliability

Adhesives technology for electronic applications materials, processing, reliability

Handbook of seal integrity in the food industry

Handbook of polymer coatings for electronics : chemistry, technology and applications

Modeling, analysis, design, and tests for electronics packaging beyond Moore

Encyclopedia of thermal packaging. Set 1, Volumes 1-6

Encyclopedia of thermal packaging. Set 1, Volumes 1-6

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010

Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010

Integrated Packaging Systems for Transportation and Distribution

Hermeticity of electronic packages

Adhesives technology for electronic applications : materials, processing, reliability

Adhesives technology for electronic applications : materials, processes, reliability

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010

Hermeticity of electronic packages

Encyclopedia of thermal packaging. Set 1, Volumes 1-6

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan

Integrated Packaging Systems for Transportation and Distribution

Handbook of polymer coatings for electronics : chemistry, technology and applications

RF and Microwave Module Level Design and Integration

Electronic Scanned Array Design

Adhesives technology for electronic applications materials, processing, reliability

Hermeticity of electronic packages

Hermeticity of electronic packages

Encyclopedia of thermal packaging. Set 1, Volumes 1-6

Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010

George Spencer Brown's "Design with the NOR" : with related essays

Hermeticity of electronic packages

ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA.

Microelectronics failure analysis : desk reference

Analog electronics applications : fundamentals of design and analysis

Green materials for electronics

Coating materials for electronic applications : polymers, processes, reliability, testing

Basic electricity and electronics for control : fundamentals and applications

Electromagnetics explained : a handbook for wireless/RF, EMC, and high-speed electronics

Adhesives technology for electronic applications : materials, processing, reliability

Dealing with electronics

ISTFA 2013 : conference proceedings from the 39th International Symposium for Testing and Failure Analysis, November 3-7, 2013, San Jose Convention Center, San Jose, California, USA

Nickel alloys for electronics

ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA

Properties of indium phosphide.

Newnes Dictionary of electronics

Smart electronic materials : fundamentals and applications

Green electronics/green bottom line : environmentally responsible engineering

Electricity and electronics fundamentals

Adhesives technology for electronic applications : materials, processes, reliability

Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages

Hermeticity of electronic packages