Modeling, analysis, design, and tests for electronics packaging beyond Moore

• Main Authors: Zhang, Hengyun, (Author), Che, Faxing, (Author), Lin, Tingyu, (Author), Zhao, Wensheng, (Author)
• Format: eBook
• Language: English
• Published: Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]
• Series: Woodhead Publishing series in electronic and optical materials.; Series on advanced electronic packaging technology and key materials.
• Subjects: Electronic apparatus and appliances > Packaging.; elektronické knihy; electronic books
• ISBN: 9780081025338; 0081025335; 9780081025321; 0081025327
• Physical Description: 1 online resource