Adhesives technology for electronic applications : materials, processes, reliability

• Main Author: Licari, James J., 1930-
• Other Authors: Swanson, Dale W.
• Format: eBook
• Language: English
• Published: Norwich, NY : William Andrew Pub., ©2005.
• Series: Materials and processes for electronic applications series.
• Subjects: Electronics > Materials.; Adhesives.; Electronic packaging.; elektronické knihy; electronic books
• ISBN: 0815515138; 9780815515135; 1591249422; 9781591249429; 9780080947167; 0080947166; 9780815516002; 0815516002
• Physical Description: 1 online resource (xvi, 459 pages) : illustrations.

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new develo...