Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010

• Corporate Author: International Conference on Components, Packaging and Manufacturing Technology Sanya Shi, China)
• Other Authors: Wu, Yanwen. (Editor)
• Format: eBook
• Language: English
• Published: Switzerland : Trans Tech Publications, 2011.
• Series: Key engineering materials ; v. 460-461.
• Subjects: Electronic apparatus and appliances > Congresses.; Electronic packaging > Congresses.; Microelectronic packaging > Congresses.; Manufacturing processes > Congresses.; elektronické knihy; electronic books
• ISBN: 9781613446713; 9780878492138; 9783038134800
• Physical Description: 1 online zdroj : ill.

The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future...