Adhesives technology for electronic applications : materials, processing, reliability

• Main Author: Licari, James J., 1930-
• Other Authors: Swanson, Dale W.
• Format: eBook
• Language: English
• Published: Amsterdam ; Boston : William Andrew Pub., 2011.
• Edition: 2nd ed.
• Series: Materials and processes for electronic applications series.
• Subjects: Electronics > Materials.; Adhesives.; Electronic packaging.; elektronické knihy; electronic books
• ISBN: 9781437778908; 1437778909; 9781437778892; 1437778895
• Physical Description: 1 online resource (viii, 403 pages) : illustrations.

This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.