Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan

• Corporate Author: Electronic Packaging Interconnect Technology Symposium Fukuoka
• Other Authors: Nogita, Kazuhiro (Editor), Salleh, Mohd Arif Anuar Mohd (Editor), Abdullah, Mohd Mustafa Al Bakri (Editor), Jamaludin, Liyana (Editor), Mohd Tahir, Muhammad Faheem (Editor)
• Format: Electronic eBook
• Language: English
• Published: Zurich : Trans Tech Publications Ltd, [2018]
• Series: Diffusion and defect data. Solid state phenomena ; volume 273.
• Subjects: Electronic packaging > Congresses.; Electronic packaging > Materials > Congresses.; elektronické knihy; electronic books
• ISBN: 9783035733242; 3035733244; 9783035713244
• Physical Description: 1 online resource