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Rheology and processing of pastes for electronic packaging materials : novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives

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Bibliographic Details
Main Author:	Durairaj, Rajkumar (Author)
Format:	Book
Language:	English
Published:	Saarbrücken : VDM Verlag Dr. Müller, 2009
Subjects:	reologie viskozita elektrotechnické materiály plošné spoje pájky (materiál) rheology viscosity electrotechnical materials printed circuits solders studie studies
ISBN:	9783639157468
Physical Description:	v, 106 s. : il., grafy ; 22 cm


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