Rheology and processing of pastes for electronic packaging materials : novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives

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Bibliographic Details
Main Author: Durairaj, Rajkumar (Author)
Format: Book
Language: English
Published: Saarbrücken : VDM Verlag Dr. Müller, 2009
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ISBN: 9783639157468
Physical Description: v, 106 s. : il., grafy ; 22 cm

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Long term loan Due : 21.12.2028  Recall This
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FT Call Number 532/DURAIRAJ,R.

Status Description Location Call Number
Long term loan - Due : 21.12.2028  Recall This FT 532/DURAIRAJ,R.