Rheology and processing of pastes for electronic packaging materials : novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives

• Main Author: Durairaj, Rajkumar (Author)
• Format: Book
• Language: English
• Published: Saarbrücken : VDM Verlag Dr. Müller, 2009
• Subjects: reologie; viskozita; elektrotechnické materiály; plošné spoje; pájky (materiál); rheology; viscosity; electrotechnical materials; printed circuits; solders; studie; studies
• ISBN: 9783639157468
• Physical Description: v, 106 s. : il., grafy ; 22 cm