Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA

• Corporate Author: International Thermal Conductivity Conference Logan, Utah
• Other Authors: Ban, Heng (Editor)
• Format: Electronic eBook
• Language: English
• Published: Lancaster, PA : DEStech Publications, 2018.
• Subjects: Heat > Conduction > Congresses.; Heat > Conduction > Measurement > Methodology > Congresses.; Materials > Thermal properties > Congresses.; Materials > Thermal properties > Measurement > Methodology > Congresses.; Expansion (Heat) > Congresses.; Expansion (Heat) > Measurement > Methodology > Congresses.; elektronické knihy; electronic books
• ISBN: 9781523153800; 1523153806; 9781605955353; 1605955353
• Physical Description: 1 online resource (xi, 265 pages)