Thermal design of liquid cooled microelectronic equipment : thermal solutions, analysis methods, and design practices

• Main Author: Yeh, L.-T. 1944- (Author)
• Format: eBook
• Language: English
• Published: New York, NY : ASME, [2019]
• Series: ASME Press book series on electronic packaging.
• Subjects: Electronic apparatus and appliances > Cooling.; Electronic apparatus and appliances > Thermal properties.; Microelectronics > Equipment and supplies.; Cold plates (Electronics); elektronické knihy; electronic books
• ISBN: 9780791861936; 0791861937
• Physical Description: 1 online resource (xi, 332 pages)

"With the demands of increased system functionalities and performance, the system power density of microelectronics equipment is continuously increased at a fast pace. This is especially true for the telecommunications systems because the network traffic in the industry has grown very rapidly e...