Advances in chemical mechanical planarization (CMP)
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...
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| Other Authors | |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Waltham, MA :
Woodhead Publishing,
[2016]
|
| Series | Woodhead Publishing series in electronic and optical materials ;
no. 86. |
| Subjects | |
| Online Access | Full text |
| ISBN | 9780081002186 0081002181 9780081001653 0081001657 |
| Physical Description | 1 online resource |