Advances in chemical mechanical planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...

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Bibliographic Details
Other Authors Babu, S. V. (Editor)
Format Electronic eBook
LanguageEnglish
Published Waltham, MA : Woodhead Publishing, [2016]
SeriesWoodhead Publishing series in electronic and optical materials ; no. 86.
Subjects
Online AccessFull text
ISBN9780081002186
0081002181
9780081001653
0081001657
Physical Description1 online resource

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