Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

• Main Author: Franke, Jörg (Prof. Dr.-Ing.), (Author)
• Format: eBook
• Language: English
• Published: Munich ; Cincinnati, OH : Hanser, [2014]
• Subjects: Interconnects (Integrated circuit technology) > Design and construction.; Injection molding of plastics.; elektronické knihy; electronic books
• ISBN: 9781569905524; 1569905525; 9781680157277; 1680157272; 9781569905517; 1569905517
• Physical Description: 1 online resource (xii, 356 pages) : color illustrations