Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

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Bibliographic Details
Main Author	Franke, Jörg (Prof. Dr.-Ing.) (Author)
Format	Electronic eBook
Language	English
Published	Munich ; Cincinnati, OH : Hanser, [2014]
Subjects	Interconnects (Integrated circuit technology) > Design and construction. Injection molding of plastics. elektronické knihy electronic books
Online Access	Full text
ISBN	9781569905524 1569905525 9781680157277 1680157272 9781569905517 1569905517
Physical Description	1 online resource (xii, 356 pages) : color illustrations

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