Introduction to microsystem packaging technology

• Main Author: Jin, Yufeng.
• Other Authors: Wang, Zhiping, 1962 October 6-, Chen, Jing, 1974-
• Format: eBook
• Language: English
• Published: Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.
• Subjects: Microelectronic packaging.; elektronické knihy; electronic books
• ISBN: 9781439865972; 1439865973; 9781628706727; 1628706724; 9781439819104; 1439819106
• Physical Description: 1 online resource (xiii, 218 pages) : illustrations

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in...