Testing of interposer-based 2.5D integrated circuits
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...
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| Main Authors | , |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Cham, Switzerland :
Springer,
2017.
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9783319547145 9783319547138 |
| Physical Description | 1 online resource (xiv, 182 pages) : illustrations (some color) |
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