More-than-Moore 2.5D and 3D SiP integration
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore?s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business a...
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| Main Author | |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Cham :
Springer,
2017.
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9783319525488 9783319525471 |
| Physical Description | 1 online resource (192 pages) |
Glossary of Terms