3D microelectronic packaging : from fundamentals to applications

• Other Authors: Li, Yan, (Editor), Goyal, Deepak, (Editor)
• Format: eBook
• Language: English
• Published: Cham, Switzerland : Springer, [2017]
• Series: Springer series in advanced microelectronics ; 57.
• Subjects: Microelectronics > Packaging.; elektronické knihy; electronic books
• ISBN: 9783319445861; 9783319445847
• Physical Description: 1 online resource (viii, 463 pages) : illustrations

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...