Carbon nanotubes for interconnects : process, design and applications
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...
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| Other Authors | , , |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Switzerland :
Springer,
[2016]
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9783319297460 9783319297446 |
| Physical Description | 1 online resource (xii, 333 pages) : illustrations (some color) |