Carbon nanotubes for interconnects : process, design and applications

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...

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Bibliographic Details
Other Authors: To-Sanial, Aida, (Editor), Dijon, Jean, (Editor), Maffucci, Antonio, (Editor)
Format: eBook
Language: English
Published: Switzerland : Springer, [2016]
Subjects:
ISBN: 9783319297460
9783319297446
Physical Description: 1 online resource (xii, 333 pages) : illustrations (some color)

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