Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers

• Main Author: Franke, Jörg, Dipl.-Ing., (Author)
• Format: eBook
• Language: English
• Published: Munich ; Cincinnati, OH : Hanser, [2014]
• Subjects: Interconnects (Integrated circuit technology) > Design and construction.; Injection molding of plastics.; elektronické knihy; electronic books
• ISBN: 9781569905524; 9781680157277; 9781569905517
• Physical Description: 1 online zdroj (xii, 356 pages) : color illustrations