Advances in CMP/polishing technologies for the manufacture of electronic devices

• Other Authors: Doi, Toshiro K., 1947-, Marinescu, Ioan D., Kurokawa, Syuhei.
• Format: eBook
• Language: English
• Published: Oxford : Elsevier, 2012.
• Edition: 1st ed.
• Subjects: Grinding and polishing.; elektronické knihy; electronic books
• ISBN: 9781437778601; 9781437778595
• Physical Description: 1 online zdroj (xii, 317 p.) ill., col. ports.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.