Electromigration in thin films and electronic devices materials and reliability

• Other Authors: Kim, Choong-Un
• Format: eBook
• Language: English
• Published: Oxford : Woodhead Pub., 2011.
• Series: Woodhead Publishing in materials.
• Subjects: Thin films.; elektronické knihy; electronic books
• ISBN: 9780857093752; 9781845699376; 9781613443910
• Physical Description: 1 online zdroj (xii, 329 p.) : ill.

Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area. Part on...