MEMS packaging

• Corporate Author: INSPEC (Information service)
• Other Authors: Hsu, Tai-Ran.
• Format: eBook
• Language: English
• Published: London : INSPEC, c2004.
• Series: EMIS processing series ; no. 3.
• Subjects: Microelectromechanical systems.; Microelectronic packaging.; elektronické knihy; electronic books
• ISBN: 9781849190626; 9780863413353; 9781615839629
• Physical Description: 1 online zdroj (xxix, 275 p.) : ill.