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MEMS packaging

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Bibliographic Details
Corporate Author INSPEC (Information service)
Other Authors Hsu, Tai-Ran
Format Electronic eBook
LanguageEnglish
Published London : INSPEC, c2004.
SeriesEMIS processing series ; no. 3.
Subjects
Microelectromechanical systems.
Microelectronic packaging.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781849190626
9780863413353
9781615839629
Physical Description1 online zdroj (xxix, 275 p.) : ill.

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