Handbook of multilevel metallization for integrated circuits materials, technology, and applications

• Other Authors: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
• Format: Electronic eBook
• Language: English
• Published: Park Ridge, N.J. : Noyes Publications, c1993.
• Series: Materials science and process technology series. Electronic materials and process technology.
• Subjects: Integrated circuits > Design and construction.; Metallizing.; elektronické knihy; electronic books
• ISBN: 9781591243649; 9780815513407; 9780815517603
• Physical Description: 1 online zdroj (xxiii, 887 p.) : ill.

It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These tea...