Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers

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Bibliographic Details
Main Author: Franke, Jörg, 1964- (Author)
Format: Book
Language: English
Published: Munich : Cincinnati : Hanser Publishers ; Hanser Publications, c2014
Subjects:
elektronické obvody
integrované obvody
vstřikování plastů
electronic circuits
integrated circuits
injection moulding
příručky
handbooks, manuals, etc
ISBN: 9781569905517
Physical Description: xii, 356 s. : barev. il. ; 25 cm

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ikona NpovdaGlossary of Terms
Status Description Location Call Number
Status
Long term loan – Due : 22.12.2026  Recall This 		Description

Location
 CPS Call Number 621.38/FRANKE,J.
Status
Long term loan – Due : 22.12.2025  Recall This 		Description

Location
 FT Call Number 621.38/FRANKE,J.

Status Description Location Call Number
Long term loan - Due : 22.12.2026  Recall This CPS 621.38/FRANKE,J.
Long term loan - Due : 22.12.2025  Recall This FT 621.38/FRANKE,J.

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