Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers

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Bibliographic Details
Main Author	Franke, Jörg, 1964- (Author)
Format	Book
Language	English
Published	Munich : Cincinnati : Hanser Publishers ; Hanser Publications, c2014
Subjects	elektronické obvody integrované obvody vstřikování plastů electronic circuits integrated circuits injection moulding příručky handbooks, manuals, etc
ISBN	9781569905517
Physical Description	xii, 356 s. : barev. il. ; 25 cm

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Holdings details from Knihovna UTB
Status	More Information	Location	Call Number
Status Long term loan – Due: 21.12.2028	More Information	Location FT	Call Number 621.38/FRANKE,J.
Status Long term loan – Due: 22.12.2026	More Information	Location CPS	Call Number 621.38/FRANKE,J.