Enhanced van der Waals epitaxy of germanium by out-of-plane dipole moment induced from transferred graphene on TiN/AlN multilayers

• Published in: Journal of applied physics Vol. 130; no. 20
• Main Authors: Wang, Xuejing, Kim, Yeonhoo, Baldwin, Jon Kevin Scott, Jones, Andrew Crandall, Jeong, Jeeyoon, Kang, Kyeong Tae, Chen, Aiping, Yoo, Jinkyoung
• Format: Journal Article
• Language: English
• Published: United States American Institute of Physics (AIP) 22.11.2021
• Subjects: 3D/2D heterostructure; contact potential difference; Ge nucleation; MATERIALS SCIENCE; surface dipole; TiN/AlN multilayer; van der Waals epitaxy
• ISSN: 0021-8979; 1089-7550

We report recent advances in 3D/2D heterostructures have opened up tremendous opportunities in building highly flexible and durable optoelectronic devices. However, the inherit lack of interfacial bonding and low surface energy of van der Waals surfaces limit the nucleation and growth of 3D materials. Enhancing wettability by providing a porous buffer is effective in growing compound semiconductors on graphene while van der Waals epitaxy of Ge remains challenging. Here, the nucleation of Ge has been significantly improved from an islanded mode to granular modes by using a TiN/AlN multilayered buffer prior to Ge/graphene integration. Highly textured Ge growth with dominating (111), (220), and (311) peaks are identified by x-ray diffraction. The microstructure of the buffer TiN/AlN demonstrates a polycrystalline quality with clean interfaces between each interlayer and the substrate. Kelvin probe force microscopy measurements along the lateral TiN/AlN interface identify a potential drop corresponding to the AlN phase. This contact potential difference between TiN and AlN is the key in generating the out-of-plane dipole moment that modifies the surface energy of the monolayer graphene, resulting in enhanced wettability of the Ge adatoms nucleated on top. Surface dipole induced nucleation of 3D semiconductor thin films on 2D materials via the proper design of buffer layer is fundamentally important to enhance the 3D/2D growth toward flexible optoelectronic applications.