Photolytic processing of materials with hydrogen

An apparatus and method for hydrogenating a sample, such as a semiconductor wafer. The invention utilizes a top electrode comprising a UV-transparent dielectric and a metal contact to provide an electric field to the sample while the sample is irradiated with UV light and hydrogenated with a hydroge...

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Bibliographic Details
Main Authors HELLMER RONALD PAUL, HOLLAND ORIN W, GOLDING TERRY D, HOSSAIN KHALID, COTTIER RYAN J
Format Patent
LanguageEnglish
Published 24.11.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An apparatus and method for hydrogenating a sample, such as a semiconductor wafer. The invention utilizes a top electrode comprising a UV-transparent dielectric and a metal contact to provide an electric field to the sample while the sample is irradiated with UV light and hydrogenated with a hydrogenating gas or gasses. The field may be applied to the sample at a number of different pressures, temperatures and concentrations of gas to manipulate the rate and type of hydrogenation. Further, the method of hydrogenating the sample may be used in conjunction with masking and etching techniques.
Bibliography:Application Number: US201113155947