Enhanced pinning property by inserted Si seed layer
The embodiments of the present invention generally relate to a magnetic head having a silicon seed layer disposed between a lower shield and a metallic underlayer to enhance the unidirectional anisotropy in an antiferromagnetic layer disposed over the metallic underlayer.
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
02.12.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The embodiments of the present invention generally relate to a magnetic head having a silicon seed layer disposed between a lower shield and a metallic underlayer to enhance the unidirectional anisotropy in an antiferromagnetic layer disposed over the metallic underlayer. |
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Bibliography: | Application Number: US201313923518 |