Thermal effect and off-center load compensation of a sensor

• Main Author: HARISH DIVYASIMHA
• Format: Patent
• Language: English
• Published: 05.06.2012
• Subjects: GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TESTING

A method and system of thermal effect and off-center load compensation of a sensor are disclosed. In one embodiment, a sensor includes a first conductive surface and a second conductive surface substantially parallel to the first conductive surface, a processing and communication zone of the first conductive surface and the second conductive surface having circuitry to enable communication with an external system (e.g., using a Universal Serial Bus (USB) interface) and a sensing area having partially a ceramic substrate surrounding a sensor surface and a reference surface of the first conductive surface and the second conductive surface. The sensor may include a set of electrical leads that enable the sensing area to communicate with the processing and communication zone and with external devices, and a guard ring surrounding the first conductive surface and the second conductive surface to minimize an effect of stray capacitance.