COMPONENT REMOVAL DEVICE

An apparatus to permit the removal of soldered components from a mounting surface. A molten solder bath is employed to heat the securing solder to its melting point. A spring loaded gripper device holds the component during the heating operation. When the securing solder becomes liquid the component...

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Bibliographic Details
Main Authors	ROBERT M. VAN ZYL, DONALD C. SEDBERRY, CHARLES A. CLASS JR
Format	Patent
Language	English
Published	29.02.1972
Subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Summary:	An apparatus to permit the removal of soldered components from a mounting surface. A molten solder bath is employed to heat the securing solder to its melting point. A spring loaded gripper device holds the component during the heating operation. When the securing solder becomes liquid the component is lifted from the mounting surface by the gripper device. During this removal process a vacuum is applied to the mounting area to remove the liquid solder from the mounting holes and the surrounding surface.
Bibliography:	Application Number: USD3644980