Ceramic printed fuse fabrication

A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible oper...

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Bibliographic Details
Main Authors Thenkarai Narayanan, Venkat raman, Horky, Miroslav, Douglass, Robert Stephen, Trublowski, John
Format Patent
LanguageEnglish
Published 04.06.2024
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Summary:A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible operation of the fusible element, respectively separated by portions of increased printed thickness.
Bibliography:Application Number: US202117538438