Ceramic printed fuse fabrication
A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible oper...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
04.06.2024
|
Subjects | |
Online Access | Get full text |
Cover
Summary: | A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible operation of the fusible element, respectively separated by portions of increased printed thickness. |
---|---|
Bibliography: | Application Number: US202117538438 |