CAMERA MODULE AND METHOD OF FABRICATING THE SAME

In one embodiment, a camera module includes a lens holder and a flexible printed circuit board, both directly attachable on an image recognition chip without using a PCB. Thus, cost can be reduced by at least the price of the PCB. Also, a size of the camera module can be reduced. A method of fabrica...

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Bibliographic Details
Main Authors KANG, SA YOON, JANG, WOO IK, KIM, DONG HAN
Format Patent
LanguageEnglish
Published 26.04.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In one embodiment, a camera module includes a lens holder and a flexible printed circuit board, both directly attachable on an image recognition chip without using a PCB. Thus, cost can be reduced by at least the price of the PCB. Also, a size of the camera module can be reduced. A method of fabricating the camera module of embodiments of the present invention can exclude chip attaching and wire bonding processes. Thus, the camera module can be fabricated within a short time using a simple assembling process.
Bibliography:Application Number: KR20040083971