WIRING AND SEMICONDUCTOR DEVICE

• Main Authors: WADA MAKOTO, KITAMURA MASAYUKI, YAMAZAKI YUICHI, SAKAI TADASHI
• Format: Patent
• Language: English
• Published: 10.06.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; NANOTECHNOLOGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide multi-layer graphene wiring and a semiconductor device having the multi-layer graphene wiring.SOLUTION: Wiring includes a substrate, a metal film provided on the substrate, a metal portion provided on the metal film, and graphene wiring formed on the metal portion. The graphene wiring is electrically in contact with the metal film, and the metal film and the metal portion are composed of different metal or alloys.