HOT MELT ADHESIVES WITH IMPROVED ADHESION TO LOW ENERGY SURFACES

• Main Authors: URBACH, DIRK, LINNENBRINK, MARTIN, PASCHKOWSKI, KAI
• Format: Patent
• Language: English; French; German
• Published: 13.07.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

Hot-melt adhesive composition (4) comprises (a) at least a polyolefin, which is solid at 25[deg] C, (b) at least a soft resin with a softening point of -10[deg] C to 40[deg] C, as measured by ring and ball method according to DIN EN 1238, and (c) at least a polar modified polyolefin wax. An independent claim is included for a composite body (1) comprising a first substrate (2), which is a polyolefin film, the hot-melt adhesive composition and a second substrate (3), where the hot-melt adhesive composition is disposed between the first and second substrate.