一种石英半导体封装装置及使用方法

• Format: Patent
• Language: Chinese
• Published: 17.10.2025
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

本发明公开了一种石英半导体封装装置及使用方法，涉及石英半导体封装技术领域，包括：工作台，所述工作台的一侧安装有伸缩缸，所述伸缩缸的执行端贯穿至所述工作台的下方固定连接有上模具，所述工作台的内侧底部安装有下模具，且所述下模具设置在所述上模具的下方，所述下模具的内侧设置有石英半导体芯片，所述下模具的一侧开设有注塑通道；升降块，设置在所述上模具的内部。本发明通过设置挤压块等零部件的配合，能够针对性地对石英半导体芯片周边的注塑材料施加往复压力，促使材料更紧密地与石英半导体芯片的引脚和芯片进行紧密贴合，减少微观空隙，提升封装层的致密度，从而大幅度提升对石英半导体芯片封装的效果。