用于非破坏性检查粘合线和孔隙率的X射线散射方法和系统

公开了用于非破坏性检查粘合线的非破坏性检查方法、系统和装置，所述粘合线包括存在于复合基材中和复合基材中的粘合剂材料层中的粘合线，所述方法、系统和装置包括小角度X射线散射阵列。 Non-destructive inspection methods, systems, and apparatuses are disclosed for non-destructively inspecting a bond line, including a bond line present in a composite substrate and in a adhesive material layers in...

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Bibliographic Details
Format Patent
LanguageChinese
Published 15.08.2025
Subjects
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Summary:公开了用于非破坏性检查粘合线的非破坏性检查方法、系统和装置，所述粘合线包括存在于复合基材中和复合基材中的粘合剂材料层中的粘合线，所述方法、系统和装置包括小角度X射线散射阵列。 Non-destructive inspection methods, systems, and apparatuses are disclosed for non-destructively inspecting a bond line, including a bond line present in a composite substrate and in a adhesive material layers in a composite substrate, with the methods, systems, and apparatuses incorporating a small angle X-ray scattering array.
Bibliography:Application Number: CN202010433059