Physical method for recovering cutting liquid, crystal silicon micro-powder and silicon carbide micro-powder from silicon wafer cutting waste mortar

The invention discloses a physical method for recovering cutting liquid, crystal silicon micro-powder and silicon carbide micro-powder from silicon wafer cutting waste mortar. The method comprises the steps that: A1, the waste silicon wafer cutting liquid is diluted by using deionized water until a...

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Bibliographic Details
Main Author GUO SHIDE
Format Patent
LanguageChinese
English
Published 25.06.2014
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Summary:The invention discloses a physical method for recovering cutting liquid, crystal silicon micro-powder and silicon carbide micro-powder from silicon wafer cutting waste mortar. The method comprises the steps that: A1, the waste silicon wafer cutting liquid is diluted by using deionized water until a water content is 50%; the mixture is well mixed by stirring; and solid-liquid separation is carried out; A2, the solid material obtained in the step A1 is filled into an overflow tank according to an actual loading volume of the overflow tank; the material is diluted until a water content is 50%; an ultrasonic transducer unit and a stirring apparatus are started; the material is well mixed, and stirring is stopped; and the ultrasonic transducer unit continues to operate until the overflowing of all the crystal silicon powder is finished, wherein during the operation process of the ultrasonic transducer unit, an overflow tank water inlet valve is opened for carrying out overflowing; and A3, silicon carbide micro-pow
Bibliography:Application Number: CN20121190750