반도체 칩 냉각용 베이퍼 챔버의 방열 성능

A vapor chamber with excellent heat transfer was developed by injecting water in a vacuum and utilizing the high heat of vaporization generated from the phase transformation from liquid to gas. To evaluate the vapor chamber cooling performance, the heat sink surface was heated and subjected to force...

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Bibliographic Details
Published in한국생산제조학회지 Vol. 33; no. 6; pp. 401 - 404
Main Authors 서정환(Jeong-hwan Seo), 진성우(Sung-woo Jin)
Format Journal Article
LanguageKorean
Published 한국생산제조학회 01.12.2024
Subjects
기계공학
CFM(cubic meter per minute)
Surface temperature
Vapor chamber
Heat sink
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ISSN2508-5093
2508-5107
DOI10.7735/ksmte.2024.33.6.401

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Summary:A vapor chamber with excellent heat transfer was developed by injecting water in a vacuum and utilizing the high heat of vaporization generated from the phase transformation from liquid to gas. To evaluate the vapor chamber cooling performance, the heat sink surface was heated and subjected to forced convection using a fan to maintain the steady state. Compared to a pure copper heat sink, the heat sink using the vapor chamber showed superior heat dissipation performance under the same experimental conditions. The performance of the vapor chamber is closely related to the degree of vacuum, and it demonstrated superior performance in products with a high degree of vacuum. KCI Citation Count: 0
ISSN:2508-5093
2508-5107
DOI:10.7735/ksmte.2024.33.6.401