무전해 Ni 도금의 전기화학적 고찰
Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Expe...
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          | Published in | Biuletyn Uniejowski Vol. 26; no. 4; pp. 175 - 182 | 
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| Main Authors | , | 
| Format | Journal Article | 
| Language | Korean | 
| Published | 
            한국표면공학회
    
        1993
     | 
| Online Access | Get full text | 
| ISSN | 1225-8024 2299-8403  | 
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| Abstract | Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets. | 
    
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| AbstractList | Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets. | 
    
| Author | 김영기(Young-Gi Kim) 이원해(Won-Hae Lee)  | 
    
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| DocumentTitle_FL | Electrochemical aspects of electroless nickel-boron plating | 
    
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| Title | 무전해 Ni 도금의 전기화학적 고찰 | 
    
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