무전해 Ni 도금의 전기화학적 고찰

Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Expe...

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Bibliographic Details
Published inBiuletyn Uniejowski Vol. 26; no. 4; pp. 175 - 182
Main Authors 김영기(Young-Gi Kim), 이원해(Won-Hae Lee)
Format Journal Article
LanguageKorean
Published 한국표면공학회 1993
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ISSN1225-8024
2299-8403

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Summary:Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.
Bibliography:KISTI1.1003/JNL.JAKO199311920548747
ISSN:1225-8024
2299-8403