전자스크랩으로부터 티오요소에 의한 은(Ag) 침출

• Published in: 대한금속·재료학회지, 56(7) Vol. 56; no. 7; pp. 511 - 517
• Main Authors: 소홍일, Hong-il So, 이주은, Joo-eun Lee, 조연철, Yeon-chul Cho, 안재우, Jae-woo Ahn, 류호진, Ho-jin Ryu
• Format: Journal Article
• Language: Korean
• Published: 대한금속재료학회 05.07.2018; 대한금속·재료학회
• Subjects: electronic scraps; leaching; silver; thiourea; 재료공학
• ISSN: 1738-8228; 2288-8241
• DOI: 10.3365/KJMM.2018.56.7.511

The leaching behavior of silver from electronic scrap using acidic thiourea solution was studied. The results showed that the silver leaching percentage was affected by the concentration of thiourea and hydrochloric acid, the oxidant such as ferric ions, solid-liquid ratio, temperature, rpm, etc. The leaching percentage of silver decreased with an increase in the solid-liquid ratio, and the leaching rate of silver was enhanced by increasing the thiourea and hydrochloric acid concentration. However, when the concentration of hydrochloric acid and oxidant were increased above 1.0 M and 30 mM, respectively, the leaching rate of silver decreased. When the reaction temperature was above 50 ℃, the leaching rate of silver decreased because of the decomposition of thiourea. More than 99 % leaching of silver was achieved under the following conditions: thiourea conc. 0.8 M, HCl conc. : 0.5 M, Temp. : 35 ℃, leaching time : 4 hours, solid-liquid ratio : 25 g/L. (Received May 11, 2018; Accepted June 6, 2018)