불소수지의 무전해 동도금을 위한 단계적 플라즈마 전처리법에 관한 연구

• Published in: Biuletyn Uniejowski Vol. 38; no. 3; pp. 118 - 125
• Main Authors: 신승한(Seunghan Shin), 한성호(Sung Ho Han), 김영석(Young Seok Kim)
• Format: Journal Article
• Language: Korean
• Published: 한국표면공학회 2005
• Subjects: 기계공학; Electroless Cu; Surface polarity; 2-step treatment; PTFE; Surface roughness; Low temperature plasma; Adhesion
• ISSN: 1225-8024; 2299-8403; 2288-8403

Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modification than $O_2$ plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with $O_2$ than $H_2$ plasma. PTFE treated with $120W-O_2$ plasma and $250w-H_2$ plasma, consecutively showed rougher surface than single step $250w-H_2$ plasma treated one and more hydrophilic than single step $120W-O_2$ plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.