불소수지의 무전해 동도금을 위한 단계적 플라즈마 전처리법에 관한 연구

Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modificat...

Full description

Saved in:
Bibliographic Details
Published inBiuletyn Uniejowski Vol. 38; no. 3; pp. 118 - 125
Main Authors 신승한(Seunghan Shin), 한성호(Sung Ho Han), 김영석(Young Seok Kim)
Format Journal Article
LanguageKorean
Published 한국표면공학회 2005
Subjects
Online AccessGet full text
ISSN1225-8024
2299-8403
2288-8403

Cover

More Information
Summary:Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modification than $O_2$ plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with $O_2$ than $H_2$ plasma. PTFE treated with $120W-O_2$ plasma and $250w-H_2$ plasma, consecutively showed rougher surface than single step $250w-H_2$ plasma treated one and more hydrophilic than single step $120W-O_2$ plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.
Bibliography:KISTI1.1003/JNL.JAKO200504704004760
G704-000261.2005.37.3.007
ISSN:1225-8024
2299-8403
2288-8403