HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems

Saved in:
Bibliographic Details
Published inIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Vol. 41; pp. 799 - 812
Main Authors Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
Format Journal Article
LanguageJapanese
Published Institute of Electrical and Electronics Engineers (IEEE) 01.04.2022
Online AccessGet full text
ISSN0278-0070
1937-4151
DOI10.1109/tcad.2021.3069370

Cover

More Information
ISSN:0278-0070
1937-4151
DOI:10.1109/tcad.2021.3069370