異材界面の剥離予測手法を用いた半導体パッケージにおける金属/樹脂界面の評価
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| Published in | スマートプロセス学会誌 Vol. 13; no. 5; pp. 240 - 245 |
|---|---|
| Main Authors | , , , , |
| Format | Journal Article |
| Language | Japanese |
| Published |
一般社団法人 スマートプロセス学会 （旧高温学会）
10.09.2024
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| Online Access | Get full text |
| ISSN | 2186-702X 2187-1337 |
| DOI | 10.7791/jspmee.13.240 |
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| Author | 久保, 悠 山本, 哲也 田靡, 京 池田, 徹 松尾, 圭一郎 |
|---|---|
| Author_xml | – sequence: 1 fullname: 池田, 徹 organization: 鹿児島大学学術研究院 理工学域工学系 機械工学プログラム – sequence: 1 fullname: 田靡, 京 organization: 東芝デバイス&ストレージ株式会社 – sequence: 1 fullname: 松尾, 圭一郎 organization: 株式会社東芝 生産技術センター – sequence: 1 fullname: 久保, 悠 organization: 株式会社東芝 生産技術センター – sequence: 1 fullname: 山本, 哲也 organization: 株式会社東芝 生産技術センター |
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| References | 5） T. Ikeda, Y. Ueno, N. Miyazaki and N. Ito: “Design for Plastic Packages of LSI Chips to Prevent Cracking during Solder Reflow Process”, Journal of Japan Institute of Electronics Packaging, 4-1 （2001）, 47-55. （in Japanese 7） T. Ikeda, Y. Komohara and N. Miyazaki: “Stress Intensity Factor Analysis of an Interface Crack between Dissimilar Materials under Thermal Stress Condition by Virtual Crack Extension Method”, Transactions of the Japan Society of Mechanical Engineers, A63-611 （1997）, 1377-1384. （in Japanese 6） M. Kitano, A. Nishimura and S. Kawai: “A Study of Package Cracking during the Reflow Soldering Process （2nd Report, Strength Evaluation of the Plastic by Using Stress Singularity Theory）”, Transactions of the Japan Society of Mechanical Engineers, A57-538 （1991）, 1398-1405. （in Japanese 1） G. Okura: “New-Generation Low-Voltage MOSFETs Contributing to High-Performance and Compact ECUs for Automotive Use”, Toshiba review, 69-8 （2014）, 16-19. （in Japanese 8） S. Kawashita, Y. Nanazoshi, T. Ikeda, M. Koganemaru, H. Hokazono and T. Asai: “Evaluation of the Delimitation of Molding Resin in a Power Module under Thermal Cycle Test”, Journal of Smart Processing, 7-4 （2018）, 146-153. （in Japanese 9） JIS Standard K7086-1993, “Testing methods for interlaminar fracture toughness of carbon fiber reinforced plastics”, （1993 2） H. Tabata: “The Influence of Adhesive Property of Epoxy Molding Compound to Reliability of Semiconductor Devices”, Journal of the Surface Finishing Society of Japan, 44-12 （1993）, 1044-1048. （in Japanese 3） SEMI G69-0996 （Reapproved 0318）, “Test Method for Measurement of Adhesive Strength between Leadframes and Molding Compounds”, （2004）. 4） M. Yamazaki and T. Iwasaki: “Evaluating of Adhesive Strength on Resin-Metal Interface”, Journal of the Surface Finishing Society of Japan, 63-12 （2012）, 739-745. （in Japanese |
| References_xml | – reference: 8） S. Kawashita, Y. Nanazoshi, T. Ikeda, M. Koganemaru, H. Hokazono and T. Asai: “Evaluation of the Delimitation of Molding Resin in a Power Module under Thermal Cycle Test”, Journal of Smart Processing, 7-4 （2018）, 146-153. （in Japanese） – reference: 5） T. Ikeda, Y. Ueno, N. Miyazaki and N. Ito: “Design for Plastic Packages of LSI Chips to Prevent Cracking during Solder Reflow Process”, Journal of Japan Institute of Electronics Packaging, 4-1 （2001）, 47-55. （in Japanese） – reference: 6） M. Kitano, A. Nishimura and S. Kawai: “A Study of Package Cracking during the Reflow Soldering Process （2nd Report, Strength Evaluation of the Plastic by Using Stress Singularity Theory）”, Transactions of the Japan Society of Mechanical Engineers, A57-538 （1991）, 1398-1405. （in Japanese） – reference: 3） SEMI G69-0996 （Reapproved 0318）, “Test Method for Measurement of Adhesive Strength between Leadframes and Molding Compounds”, （2004）. – reference: 2） H. Tabata: “The Influence of Adhesive Property of Epoxy Molding Compound to Reliability of Semiconductor Devices”, Journal of the Surface Finishing Society of Japan, 44-12 （1993）, 1044-1048. （in Japanese） – reference: 4） M. Yamazaki and T. Iwasaki: “Evaluating of Adhesive Strength on Resin-Metal Interface”, Journal of the Surface Finishing Society of Japan, 63-12 （2012）, 739-745. （in Japanese） – reference: 7） T. Ikeda, Y. Komohara and N. Miyazaki: “Stress Intensity Factor Analysis of an Interface Crack between Dissimilar Materials under Thermal Stress Condition by Virtual Crack Extension Method”, Transactions of the Japan Society of Mechanical Engineers, A63-611 （1997）, 1377-1384. （in Japanese） – reference: 1） G. Okura: “New-Generation Low-Voltage MOSFETs Contributing to High-Performance and Compact ECUs for Automotive Use”, Toshiba review, 69-8 （2014）, 16-19. （in Japanese） – reference: 9） JIS Standard K7086-1993, “Testing methods for interlaminar fracture toughness of carbon fiber reinforced plastics”, （1993） |
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| Title | 異材界面の剥離予測手法を用いた半導体パッケージにおける金属/樹脂界面の評価 |
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