大径シリコンウエハ加工用ロータリ研削盤の開発（第２報：切込み機構内蔵砥石スピンドルの基本特性の検討）
Saved in:
| Published in | 日本機械学会論文集 Vol. 83; no. 852; p. 17-00102 |
|---|---|
| Main Authors | , , , , , , , |
| Format | Journal Article |
| Language | Japanese |
| Published |
一般社団法人 日本機械学会
2017
|
| Subjects | |
| Online Access | Get full text |
| ISSN | 2187-9761 |
| DOI | 10.1299/transjsme.17-00102 |
Cover
| Author | 岩橋, 伸太郎 X., Lu 本多, 歩 由井, 明紀 伊東, 利洋 H., Slocum A. 楠山, 純平 北嶋, 孝之 |
|---|---|
| Author_xml | – sequence: 1 fullname: 本多, 歩 organization: 防衛大学校 – sequence: 1 fullname: X., Lu organization: ブリティッシュコロンビア大学 – sequence: 1 fullname: 北嶋, 孝之 organization: 防衛大学校 – sequence: 1 fullname: 楠山, 純平 organization: 防衛大学校 – sequence: 1 fullname: 岩橋, 伸太郎 organization: 防衛大学校 – sequence: 1 fullname: 伊東, 利洋 organization: （株）岡本工作機械製作所 – sequence: 1 fullname: 由井, 明紀 organization: 防衛大学校 – sequence: 1 fullname: H., Slocum A. organization: マサチューセッツ工科大学 |
| BookMark | eNo9kMtKw0AUhgdRsF5ewHdIncm0SWYpxSsFN7oO02SiLbZK0o07m3hpKyhIEbxAu6jWSxWkSFFC-zDDJHXVVzBVkQPnPwd-vh_-KTBe2C0wAOYQjCOZkPmiTQtOzsmzOFIlCBGUx0BMRpoqEVVBk2DWcbIZiBU5qWE1GQOXotkSvUPudrn3xN0O9zrcvefuA_fORbUhundhLbpfuOdztx95wkZNVKrhTZOXXr8uT8Orz6FfDtvtoX8hGm9D_1qUTwY9n5f6wWM9aJ2K46NB7T1s3IX1iPzBvdoowqtw7zkiiPpncNsOKx_BQSt6g-bt4OFs6FdmwIRFdxw2-6fTYHNpcSO1IqXXl1dTC2kphwikkqExDVMFWiaJtgxNChEihpYxLUQtQhKMYKLiTMKwEgpUk5BFg01kmggxhWh4Gqz9cnNOkW4xfc_O5qm9r1O7mDV2mP5fp65hXUvKI0Gq_lPsv8nYpraeo_gbvIWvTw |
| ContentType | Journal Article |
| Copyright | 2017 一般社団法人日本機械学会 |
| Copyright_xml | – notice: 2017 一般社団法人日本機械学会 |
| DOI | 10.1299/transjsme.17-00102 |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISSN | 2187-9761 |
| EndPage | 17-00102 |
| ExternalDocumentID | article_transjsme_83_852_83_17_00102_article_char_ja |
| GroupedDBID | ALMA_UNASSIGNED_HOLDINGS GROUPED_DOAJ JSF KQ8 RJT |
| ID | FETCH-LOGICAL-j190a-c8e83a60fd9a6020da0119c8bdf1af994e93973b4cf460750e0e03d1dd11e6983 |
| IngestDate | Wed Sep 03 06:29:49 EDT 2025 |
| IsDoiOpenAccess | true |
| IsOpenAccess | true |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 852 |
| Language | Japanese |
| LinkModel | OpenURL |
| MergedId | FETCHMERGED-LOGICAL-j190a-c8e83a60fd9a6020da0119c8bdf1af994e93973b4cf460750e0e03d1dd11e6983 |
| OpenAccessLink | https://www.jstage.jst.go.jp/article/transjsme/83/852/83_17-00102/_article/-char/ja |
| ParticipantIDs | jstage_primary_article_transjsme_83_852_83_17_00102_article_char_ja |
| PublicationCentury | 2000 |
| PublicationDate | 2017 |
| PublicationDateYYYYMMDD | 2017-01-01 |
| PublicationDate_xml | – year: 2017 text: 2017 |
| PublicationDecade | 2010 |
| PublicationTitle | 日本機械学会論文集 |
| PublicationYear | 2017 |
| Publisher | 一般社団法人 日本機械学会 |
| Publisher_xml | – name: 一般社団法人 日本機械学会 |
| References | Hara, K., Isobe, A., Nagata, H., Iwase, A., Tomita, Y., Kanai, A. and Miyashita, M., Si Wafer you chouseimitu ryoutoukennsakubann no kaihatu, 1st report: System kousei to seinouhyouka, 1999 Japan Society for Precision Engineering Spring Meeting (1999), p.673 (in Japanese). Lu, X., Paone, M., Usman, I., Slocum, A. and Yui, A., Rotary-axial spindles for precision manufacturing, Proceedings of ASPE (2008), pp.17-20. Yui, A., Honda, A., Kitajima, T., Saito, H., Lu, X. and Slocum, A. H., Development of vertical-spindle rotary surface grinding machine for large-scale silicon-wafers: Static stiffness of grinding spindle and worktable, Proceedings of the 14th euspen International Conference (2014). Abe, K., Yasunaga, N., Miyashita, M., Yoshioka, J.and Daito, M., Ductile mode grinding for silicon wafer, Abrasive Technology Conference (1993), pp.227-232 (in Japanese). Iwahashi, S., Honda, A., Kusuyama, J., Kitajima, T., Yui, A., Saito, H. and Slocum, A. H., Development of grinding machine for 450mm wafer, Fundamental performance of wheel spindle which creates both rotary and axial feed motion, 10th Manufacturing & Machine Tool Conference (2014) (in Japanese). Une, A., Ohbo, S. and Mochida, M., Development of an oscillation-speed-control-type sequential grinding and polishing machine, 1st report: Machine structure and basic polishing characteristics, Journal of the Japan Society for Precision Engineering, Vol.68, No.3 (2002), pp.461-465. Slocum, A. H., Chiu, M. A., Hobbs, E. D., Rothenhöfer, G. and Yui, A., Kinematic and elastically averaged joints: Connecting the past, present and future, Proceedings of ISUPEN (2013), pp.1-4. The Japan Machine Tool Builders’ Association , Japan Machinery Federation, Kosaku kikai sekkei manual－Kosaku kikai no sekkeigaku (Ouyou-hen)－“Mather machine sekkei notameno kisochishik”, Japan Machine Tool Builders’ Association, Japan Machinery Federation (2003), pp.12-14 (in Japanese). Yui, A., Honda, A., Okuyama, S., Kitajima, T., Okhata, G., Saito, H. and Slocum, A. H., Development of vertical-spindle rotary surface grinding machine for large scale silicon-wafers: Machine specifications and performance of rotary work table, Proc. of the 13th euspen International Conference (2013), pp.224-227. Koiwai, T., Honda, A., Okahata, G., Kitajima, T., Yui, A., Okuyama, S., Kobayashi, H. and Slocum, A.H., Development of grinding machine for 450mm wafer, 1st report: Specification and fundamental performance of the grinding machine, 9th Manufacturing & Machine Tool Conference (2012) (in Japanese). Kusuyama, J., Honda, A., Kitajima, T., Okahata, G., Yui, A., Ito, T. and Slocum, A. H., Development of rotary table grinding machine for large diameter Si wafers, 1st report: Performance investigation of water hydrostatic rotary table, Transactions of the JSME (in Japanese), Vol. 82, No. 842 (2016), DOI: 10.1299/transjsme.16-00190. The Institute of Electrical Engineers of Japan, Magnetic levitation systems and magnetic bearings (1993) (in Japanese). Kramer, S., 450mm Technology - Motivations & key elements, SEMICON Europa (2009). Yui, A., Suzuki, S., Okonogi, H. and Mitsui, K., Development of an ultra precision surface grinding machine using hydrostatic bearing, Journal of the Japan Society of Grinding Engineers, Vol.41, No.10 (1997), pp.376-381. Honda, A., Koiwai, T., Okahata, G., Kitajima, T., Yui, A., Okuyama, S., Kobayashi, H. and Slocum, A.H., Development of grinding machine for 450mm wafer, 2nd report: numerical analysis of static stiffness and load capacity of water hydrostatic table, 9th Manufacturing & Machine Tool Conference (2012) (in Japanese). G450C HP, available from<http://www.g450c.org/>, (accessed on 30 March, 2016). The Japan Machine Tool Builders’ Association, Japan Machinery Federation, Kosaku kikai sekkei manual－Kosaku kikai no sekkeigaku (Kiso-hen)－“Mather machine wo sirutameni”, Japan Machine Tool Builders’ Association, Japan Machinery Federation (1998), p.60 (in Japanese). Rothenhöfer, G., Slocum, A. H., Paone, M. P., Lu, X. and Yui, A., Elements for the design of next generation, high stiffness and high accuracy precision machines, Proc. of 11th euspen International Conference (2011), pp.260-266. Isobe, A., Tomit, Y., Hara, K., Iwase, A., Tsukahara, S. and Abe, K., φ400 wafer no chouseimitu ryoutoukennsakugijutu nokennkyuu, 2nd report: Souchiseinou no kenshou (Gousei / Undouseinou), 2000 Japan Society for Precision Engineering Spring Meeting (2000) p.31 (in Japanese). Iwahashi, S., Honda, A., Kusuyama, J., Kitajima, T., Yui, A., Saito, H. and Slocum, A. H., Development of rotary grinding machine for 450mm si wafer, Positioning accuracy of wheel spindle which create both rotary and axial feed motions, JSME annual meeting 2015 (2015) (in Japanese). Rothenhöfer, G., Slocum, A. and Kitajima, T., An adjustable kinematic coupling for use in machine tools with a tight structural loop, Precision Engineering, 37 (2013), pp.61-72. Kusuyama, J., Iwahashi, S., Kitajima, T., Ogasawara, N., Yui, A., Saito, H. and Slocum, A. H., Loop Stiffness of grinding machine developed for 450 mm silicon wafers, Advances in abrasive technology XVIII (2015), pp.655-660. The Japan Society of Mechanical Engineers, JSME data book: thermophysical properties of fluids, Journal of the Japan Society of Mechanical Engineers (1943), pp.208-209 (in Japanese). |
| References_xml | – reference: Yui, A., Honda, A., Kitajima, T., Saito, H., Lu, X. and Slocum, A. H., Development of vertical-spindle rotary surface grinding machine for large-scale silicon-wafers: Static stiffness of grinding spindle and worktable, Proceedings of the 14th euspen International Conference (2014). – reference: Yui, A., Honda, A., Okuyama, S., Kitajima, T., Okhata, G., Saito, H. and Slocum, A. H., Development of vertical-spindle rotary surface grinding machine for large scale silicon-wafers: Machine specifications and performance of rotary work table, Proc. of the 13th euspen International Conference (2013), pp.224-227. – reference: Kusuyama, J., Honda, A., Kitajima, T., Okahata, G., Yui, A., Ito, T. and Slocum, A. H., Development of rotary table grinding machine for large diameter Si wafers, 1st report: Performance investigation of water hydrostatic rotary table, Transactions of the JSME (in Japanese), Vol. 82, No. 842 (2016), DOI: 10.1299/transjsme.16-00190. – reference: Lu, X., Paone, M., Usman, I., Slocum, A. and Yui, A., Rotary-axial spindles for precision manufacturing, Proceedings of ASPE (2008), pp.17-20. – reference: Yui, A., Suzuki, S., Okonogi, H. and Mitsui, K., Development of an ultra precision surface grinding machine using hydrostatic bearing, Journal of the Japan Society of Grinding Engineers, Vol.41, No.10 (1997), pp.376-381. – reference: Kramer, S., 450mm Technology - Motivations & key elements, SEMICON Europa (2009). – reference: The Institute of Electrical Engineers of Japan, Magnetic levitation systems and magnetic bearings (1993) (in Japanese). – reference: Abe, K., Yasunaga, N., Miyashita, M., Yoshioka, J.and Daito, M., Ductile mode grinding for silicon wafer, Abrasive Technology Conference (1993), pp.227-232 (in Japanese). – reference: Hara, K., Isobe, A., Nagata, H., Iwase, A., Tomita, Y., Kanai, A. and Miyashita, M., Si Wafer you chouseimitu ryoutoukennsakubann no kaihatu, 1st report: System kousei to seinouhyouka, 1999 Japan Society for Precision Engineering Spring Meeting (1999), p.673 (in Japanese). – reference: Honda, A., Koiwai, T., Okahata, G., Kitajima, T., Yui, A., Okuyama, S., Kobayashi, H. and Slocum, A.H., Development of grinding machine for 450mm wafer, 2nd report: numerical analysis of static stiffness and load capacity of water hydrostatic table, 9th Manufacturing & Machine Tool Conference (2012) (in Japanese). – reference: Iwahashi, S., Honda, A., Kusuyama, J., Kitajima, T., Yui, A., Saito, H. and Slocum, A. H., Development of grinding machine for 450mm wafer, Fundamental performance of wheel spindle which creates both rotary and axial feed motion, 10th Manufacturing & Machine Tool Conference (2014) (in Japanese). – reference: Rothenhöfer, G., Slocum, A. and Kitajima, T., An adjustable kinematic coupling for use in machine tools with a tight structural loop, Precision Engineering, 37 (2013), pp.61-72. – reference: Isobe, A., Tomit, Y., Hara, K., Iwase, A., Tsukahara, S. and Abe, K., φ400 wafer no chouseimitu ryoutoukennsakugijutu nokennkyuu, 2nd report: Souchiseinou no kenshou (Gousei / Undouseinou), 2000 Japan Society for Precision Engineering Spring Meeting (2000) p.31 (in Japanese). – reference: The Japan Machine Tool Builders’ Association , Japan Machinery Federation, Kosaku kikai sekkei manual－Kosaku kikai no sekkeigaku (Ouyou-hen)－“Mather machine sekkei notameno kisochishik”, Japan Machine Tool Builders’ Association, Japan Machinery Federation (2003), pp.12-14 (in Japanese). – reference: Une, A., Ohbo, S. and Mochida, M., Development of an oscillation-speed-control-type sequential grinding and polishing machine, 1st report: Machine structure and basic polishing characteristics, Journal of the Japan Society for Precision Engineering, Vol.68, No.3 (2002), pp.461-465. – reference: Slocum, A. H., Chiu, M. A., Hobbs, E. D., Rothenhöfer, G. and Yui, A., Kinematic and elastically averaged joints: Connecting the past, present and future, Proceedings of ISUPEN (2013), pp.1-4. – reference: Iwahashi, S., Honda, A., Kusuyama, J., Kitajima, T., Yui, A., Saito, H. and Slocum, A. H., Development of rotary grinding machine for 450mm si wafer, Positioning accuracy of wheel spindle which create both rotary and axial feed motions, JSME annual meeting 2015 (2015) (in Japanese). – reference: Kusuyama, J., Iwahashi, S., Kitajima, T., Ogasawara, N., Yui, A., Saito, H. and Slocum, A. H., Loop Stiffness of grinding machine developed for 450 mm silicon wafers, Advances in abrasive technology XVIII (2015), pp.655-660. – reference: The Japan Society of Mechanical Engineers, JSME data book: thermophysical properties of fluids, Journal of the Japan Society of Mechanical Engineers (1943), pp.208-209 (in Japanese). – reference: G450C HP, available from<http://www.g450c.org/>, (accessed on 30 March, 2016). – reference: The Japan Machine Tool Builders’ Association, Japan Machinery Federation, Kosaku kikai sekkei manual－Kosaku kikai no sekkeigaku (Kiso-hen)－“Mather machine wo sirutameni”, Japan Machine Tool Builders’ Association, Japan Machinery Federation (1998), p.60 (in Japanese). – reference: Rothenhöfer, G., Slocum, A. H., Paone, M. P., Lu, X. and Yui, A., Elements for the design of next generation, high stiffness and high accuracy precision machines, Proc. of 11th euspen International Conference (2011), pp.260-266. – reference: Koiwai, T., Honda, A., Okahata, G., Kitajima, T., Yui, A., Okuyama, S., Kobayashi, H. and Slocum, A.H., Development of grinding machine for 450mm wafer, 1st report: Specification and fundamental performance of the grinding machine, 9th Manufacturing & Machine Tool Conference (2012) (in Japanese). |
| SSID | ssib036258375 ssib016970096 ssib051641555 ssj0002911760 |
| Score | 2.0858643 |
| SourceID | jstage |
| SourceType | Publisher |
| StartPage | 17-00102 |
| SubjectTerms | High stiffness Large-diameter Si wafer Magnetic actuator Rotary grinding machine Wheel spindle |
| Title | 大径シリコンウエハ加工用ロータリ研削盤の開発（第２報：切込み機構内蔵砥石スピンドルの基本特性の検討） |
| URI | https://www.jstage.jst.go.jp/article/transjsme/83/852/83_17-00102/_article/-char/ja |
| Volume | 83 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| ispartofPNX | 日本機械学会論文集, 2017, Vol.83(852), pp.17-00102-17-00102 |
| journalDatabaseRights | – providerCode: PRVAFT databaseName: Open Access Digital Library databaseCode: KQ8 dateStart: 20140101 customDbUrl: isFulltext: true eissn: 2187-9761 dateEnd: 99991231 titleUrlDefault: http://grweb.coalliance.org/oadl/oadl.html omitProxy: true ssIdentifier: ssj0002911760 providerName: Colorado Alliance of Research Libraries – providerCode: PRVHPJ databaseName: ROAD: Directory of Open Access Scholarly Resources databaseCode: M~E dateStart: 20140101 customDbUrl: isFulltext: true eissn: 2187-9761 dateEnd: 99991231 titleUrlDefault: https://road.issn.org omitProxy: true ssIdentifier: ssib051641555 providerName: ISSN International Centre |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwrV3La9RAGA-lXvQgPvFND85Jtu5sXjPHyTZLEfXUQm9LdpMcFnyg7cWD2F0f3RYUZCmohe6htVWrIEVKy9L-Ef4JIZt62n_B75skuyn1oEU2ZCeT7_vN95hkvhlmJopyXVN932WOjqtxnJzmUS_HdV7NUc00qebnfZPi4uQ7d43xSe3WlD41NPwzM2tpZroyWn3yx3UlR_Eq5IFfcZXsP3i2DwoZkAb_whk8DOe_8jGxdSI0IkxMWDZhGrFVwgrEMmVCJUKkOWqSkyQKRBhpgiW3WAlxmCAiLwFNInRim4RrAxoxluIUU-RSpiwTeYEecThCIbuFQiINJcImNifcIMyStzixgKaEaIxJ9iIecQ4vSAXzxKJpjpDIjDBQkKHKiRhUimEQAeBxwpRFADGUpSMxSGXpiYSJXqWBNSyeaMG1g4ZSUZFEQSujhS7ZBZbFY5lNpEQcA6ePCDNDbKAFgAzEAEsyO1WZZ_sGEiq2eR8zqxEIKf0CLkDfaalBGAoGJkUuQ1qGo81Zf8w1gyfrCzDBgyUxAao_EjQlG4rbMwM2sF4RRcLKIF0m2aQEfExKAD62ssUIPa08FA9JbxJLS-oE0FtqdqApXlErXwoSj6HpQCNwcWxSENeKrQ21SMUiwC9cl8QCjhtHs1ocl8gGEKJPMwfhMs221vFnj5K3Eot3P04aX4i35BaJmWAum3UoWIBIDJ7waYwJa4_veaMH-Q9swp484uU-cZmpZSgd_yjO4AC2ckqE6yXLNei0HSvgICHOJ35qp40cNbiJ4wbpNQSQOlMHMbxODYzx9f5AcQHCEdPIJwv-QOabhyWG8LkGncl0IqqMjSdOKSeTTu2IiCU7rQzVnDPKicxWp2eVxXBlLdx9HtS3gsbnoL4ZNDaD-segvh403oTz7XBrNWpB-mvQ6AT1PaCJ2q2wOR99WAlmv_1aXIje7fQ6c9HGRq_zNmx_73Xeh3Ov9nc7wexe99Nyd20hfPliv_Ujaq9Gy4C8HTRaWESjGTS-AEK4vNNd2oia291na3DZXVnaX3_d6zTPKZMle6I4nku-CZOrQdfFyVWZx1THyPsuh3Mh7zq4aWWVVVyfOj7nmsehh6VWtKqvGdgd8uCnutR1KfUMztTzyvD9B_e9C8qIR42K4TpVHZojzS3kK46juyzveQXTZ8znF5VibNTyw3jjn_JRasGl_4JyWTmOj2Q89ntFGZ5-NONdhd7QdOWarF2_AU6gNT8 |
| linkProvider | ISSN International Centre |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=%E5%A4%A7%E5%BE%84%E3%82%B7%E3%83%AA%E3%82%B3%E3%83%B3%E3%82%A6%E3%82%A8%E3%83%8F%E5%8A%A0%E5%B7%A5%E7%94%A8%E3%83%AD%E3%83%BC%E3%82%BF%E3%83%AA%E7%A0%94%E5%89%8A%E7%9B%A4%E3%81%AE%E9%96%8B%E7%99%BA%EF%BC%88%E7%AC%AC%EF%BC%92%E5%A0%B1%EF%BC%9A%E5%88%87%E8%BE%BC%E3%81%BF%E6%A9%9F%E6%A7%8B%E5%86%85%E8%94%B5%E7%A0%A5%E7%9F%B3%E3%82%B9%E3%83%94%E3%83%B3%E3%83%89%E3%83%AB%E3%81%AE%E5%9F%BA%E6%9C%AC%E7%89%B9%E6%80%A7%E3%81%AE%E6%A4%9C%E8%A8%8E%EF%BC%89&rft.jtitle=%E6%97%A5%E6%9C%AC%E6%A9%9F%E6%A2%B0%E5%AD%A6%E4%BC%9A%E8%AB%96%E6%96%87%E9%9B%86&rft.au=%E6%9C%AC%E5%A4%9A%2C+%E6%AD%A9&rft.au=X.%2C+Lu&rft.au=%E5%8C%97%E5%B6%8B%2C+%E5%AD%9D%E4%B9%8B&rft.au=%E6%A5%A0%E5%B1%B1%2C+%E7%B4%94%E5%B9%B3&rft.date=2017&rft.pub=%E4%B8%80%E8%88%AC%E7%A4%BE%E5%9B%A3%E6%B3%95%E4%BA%BA+%E6%97%A5%E6%9C%AC%E6%A9%9F%E6%A2%B0%E5%AD%A6%E4%BC%9A&rft.eissn=2187-9761&rft.volume=83&rft.issue=852&rft.spage=17-00102&rft.epage=17-00102&rft_id=info:doi/10.1299%2Ftransjsme.17-00102&rft.externalDocID=article_transjsme_83_852_83_17_00102_article_char_ja |