APA (7th ed.) Citation

Koike, J., Haneda, M., Iijima, J., & Wada, M. (2006). Cu Alloy Metallization for Self-Forming Barrier Process. Proceedings of the IEEE International Interconnect Technology Conference, 161-163. https://doi.org/10.1109/IITC.2006.1648676

Chicago Style (17th ed.) Citation

Koike, J., M. Haneda, J. Iijima, and M. Wada. "Cu Alloy Metallization for Self-Forming Barrier Process." Proceedings of the IEEE International Interconnect Technology Conference 2006: 161-163. https://doi.org/10.1109/IITC.2006.1648676.

MLA (9th ed.) Citation

Koike, J., et al. "Cu Alloy Metallization for Self-Forming Barrier Process." Proceedings of the IEEE International Interconnect Technology Conference, 2006, pp. 161-163, https://doi.org/10.1109/IITC.2006.1648676.