Staggering Preventive Maintenance Actions at CMP Using a Dispatching Algorithm

In a semiconductor fab, distributing wafers equally across a toolset (set of tools that perform similar operations) helps achieve a higher throughput as opposed to loading them unevenly. However, in some processing steps, level loading tools leads to uniform usage of consumables (material used up at...

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Bibliographic Details
Published inASMC proceedings pp. 1 - 6
Main Authors Ramakrishnan, Srikanth, Chakravorty, Shiladitya, Tay, Jensen, Olsen, David, Zumpano, Peter
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2020
Subjects
Dispatching
Preventive maintenance
Production
Surface treatment
Throughput
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ISSN2376-6697
DOI10.1109/ASMC49169.2020.9185225

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Summary:In a semiconductor fab, distributing wafers equally across a toolset (set of tools that perform similar operations) helps achieve a higher throughput as opposed to loading them unevenly. However, in some processing steps, level loading tools leads to uniform usage of consumables (material used up at a tool in processing wafers) and can trigger simultaneous Preventive Maintenance (PM) actions to replenish them. Managing simultaneous PMs with a small maintenance team reduces tool availability while using a bigger workforce entails higher costs. This study presents ways to overcome this situation by staggering PM actions across tools
ISSN:2376-6697
DOI:10.1109/ASMC49169.2020.9185225